Tool Function and Specifications
This high-precision steel mesh stencil is designed with a 0.12mm thickness to achieve precise tin planting during chip-level smartphone repairs. It allows hardware engineers to perform a process called “reballing,” which involves replacing the faulty or loose solder joints beneath major integrated circuits (ICs) like the central processor and power chips.
Supported Hardware
The stencil is specifically configured to fit the pin layout of the following hardware:
- Processor Family: Qualcomm Snapdragon 835 (MSM8998 CPU)
- Compatible Smartphone Models: LG V30, LG V30P, LG V30S, LG V30S+, and LG H930DS
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