Technical Specifications
- Thickness: 0.12 mm for uniform, high-precision solder paste application.
- Material: Premium, ultra-thin stainless steel resistant to high heat deformation.
- Manufacturing: High-precision laser-cut apertures for clean and accurate tin planting.
- Aperture Layout: Tailored precisely to match the pin layout of specific MediaTek Dimensity CPUs and accompanying IC components.
Supported Chipsets & CPUs
This single-piece template houses square, high-precision cutouts that perfectly fit several MediaTek Dimensity processors and power IC chips:
- MediaTek Processors: MT6833V, MT6877V, MT6891Z, and MT6893Z.
- Dimensity Platforms: Dimensity 700, 810, 900, 1080, 1100, and 1200.
- Power Management / Supporting ICs: MT6315CP, MT6315GP, MT6359, MT6365, and MT6390MV.
Device Compatibility
The stencil widely covers middle-to-high-end Xiaomi ecosystem hardware platforms, including:
- Redmi Series: Note 10 Pro, Note 11 Pro, Note 11E, Note 12 Pro, Note 12 Pro+, and Redmi K11.
- Poco Series: Poco M3 Pro, Poco M4 Pro, and Poco X3 GT.
- Xiaomi Series: Mi M3 and Mi M4 Pro.
Core Functionality
- Solder Paste Deposition: Aligns perfectly over the PCB or desoldered chip to accurately deposit a precise volume of solder paste.
- Single-Pass Reballing: Allows proficient technicians to form consistent solder balls in a single step under a hot air rework station.
- Anti-Bulging Profile: Engineered to resist heat warping during direct heating with a hot air gun, minimizing repair errors.
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