The selected region features the Amaoe MT2 BGA Reballing Stencil, a specialized high-precision template designed for smartphone repair technicians. It is used to accurately apply solder balls to MediaTek (MTK) series power management IC chips during hardware repair and replacement.
Key Specifications & Compatibility
- Thickness: Optimized at 0.12 mm to control solder paste volume and prevent bridging.
- Design Feature: Incorporates a heat dissipation anti-bulging design to stay flat and prevent warping under hot air guns.
- Supported IC Models: Specifically laser-cut to match MediaTek PMIC layouts including MT6356W, MT6322, MT6325V, MT6329, MT6353V, MT6355W, MT6371P, MT6370P, MT6290MA, MT6261MA, MT6360P, MT6311DP, MT6337WP, MT6357CRV, MT6358W, MP6335WP, MT6359VKP, and MT6303P.
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