Supported Chips & Components
The stencil incorporates precise cutout patterns for several essential mobile hardware components:
- MT6799W CPU & RAM: Dedicated grids for both the primary processor and its layered or accompanying RAM chip.
- MBG967W: Component-specific ball-grid layout.
- MT6179W & MT6335WP: Power management or radio-frequency (RF) signal processing chips.
- Peripheral ICs: Dedicated sections for standard smaller architectures including 56022, RF5228, BGA153, and MT6337WP.
Primary Applications
- IC Reballing: Reapplying precision solder balls to the bottom of clean integrated circuits before reattachment.
- Chip Reworking: Repairing smartphones suffering from boot loops, power failure, or physical impact damage affecting the motherboard components.
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