🛠️ Key Product Details
- Thickness: 0.12 mm precision laser-cut sheet.
- Hole Shape: Standard square design engineered to prevent solder balls from sticking during heat application.
- Material: Built using high-grade, heat-resistant steel alloys to withstand direct thermal profiling without warping.
📱 Supported Qualcomm Chips
The laser etchings across the stencil match specific integrated circuit layouts:
| Chip Series | Part/Model Numbers |
|---|---|
| Snapdragon 460 | SM4250 |
| Snapdragon 665 | SM6125 |
| Snapdragon 720G / 730G | SM7125 / SM7150 |
| Snapdragon 750G | SM7225 |
| Snapdragon 765G | SM7250 / SM7260 |
| Snapdragon 775G | SM7350 |
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