Key Product Specifications
- Compatible Device Models: Samsung Galaxy S20 series, specifically targeting the SM-G986B, SM-G985F, and SM-G986N logic boards.
- Stencil Thickness: 0.12 mm thickness, allowing for precise solder paste application during the reballing process.
- Stencil Dimensions: 70 mm × 70 mm square footprint.
- Magnetic Feature: Explicitly marked as 强磁性 (Strongly Magnetic), making it highly compatible with magnetic positioning platforms used to hold the motherboard layers in place safely.
Primary Purpose and Use Case
This specialized tool is used by professional micro-soldering technicians for hardware repair on “sandwich” or double-stacked motherboards. Due to drops or thermal stress, the connection between the top and bottom boards can break. Technicians desolder the two layers, clean off the old solder, and use this high-precision stencil to paint fresh solder paste spheres onto the interlocking middle layer pads before aligning and refusing the boards back together.
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