Key Product Specifications
- Thickness: 0.12 mm
- Function: Middle layer (interposer) mainboard tin planting/soldering
- Compatibility: Designed specifically for the Samsung Galaxy S22 variant series (Models: SM-S906U / S901U / W / 0 / D / E).
- Application: Enables micro-soldering technicians to precisely align and replace microscopic solder balls (reballing) between the sandwiched motherboard layers of the phone.





Reviews
There are no reviews yet.