Core Hardware Specifications
- Component Type: Power Management IC (PMIC) / Power Chip.
- Package/Form Factor: BGA (Ball Grid Array) microchip designed for high-density mobile surface mounting.
- Primary Compatibility: Engineered primarily for Huawei and Honor flagship mobile devices using Kirin 950 and Kirin 960 platforms.
- Common Hardware Revisions:
- HI6422 V1 / V100 / GWCV100 (First generation)
- HI6422 GWCV210 / V211 / V212 (Subsequent iterations)
Device Compatibility
The V1 variant of this component is natively used as the main power controller in several legacy devices including
- Huawei Mate 8
- Huawei Mate 9
- Huawei P9 / P9 Plus
- Huawei P10 / P10 Plus
Functional Features
- Multi-channel Voltage Regulation: Integrates highly efficient step-down (Buck) switch-mode converters alongside low-dropout (LDO) linear regulators.
- Processor Power Sequencing: Controls the precise timing circuits required to turn on the CPU, GPU, system RAM, and internal flash memory.
- Thermal Protection: Integrates an on-chip thermal monitoring sensor that shuts down system power lines if safe operational temperatures are exceeded.
- I2C/SPI System Interface: Utilizes standard digital communication buses to dynamically change voltage levels (DVFS) requested by the main application processor.
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