Key Specifications
- Dimensions: 2.0mm width and 1.5m length per spool.
- Packaging: Typically distributed as a 3-piece pack in individually sealed protective cases to prevent oxidation.
- Material: Composed of a high-purity flat-needle type copper braid pre-fluxed with high-quality rosin.
Standout Features
- High Thermal Conductivity: Designed for rapid heat transfer, allowing quick tin suction and minimizing thermal stress on delicate circuit components.
- Advanced Chemical Formula: Provides excellent resistance to oxidation and corrosion while leaving minimal, non-corrosive residue on the board.
- Obvious Tin-Climbing Effect: The flat braided structure pulls away leaded or lead-free solders smoothly from pads without fraying at the front end.
Common Applications
The wick is ideal for routine circuit work, micro-soldering, and complex electronic rework:
- Mobile phone and laptop motherboard cleaning.
- IC and SMD component replacement.
- Cleaning excess solder from dense solder pads.
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