Key Features:
-
- Thermochromic Technology: The pad uses heat-sensitive, color-changing material that turns white at temperatures ≥35°C. This provides an instant visual indicator of overheating points or leakage currents on a PCB.
- High Transparency & 0.5mm Thickness: Its ultra-thin, flexible design allows it to closely adhere to uneven components. Because it is highly transparent, technicians can see the traces and components directly underneath while diagnosing.
- Reusable & Clean: It is fully reversible—once the board cools down, the pad returns to its original color. Unlike rosin tests, it is smokeless and odorless, keeping the repair bench clean.
- Simple Workflow: There is no calibration or adjustment required. Technicians simply stick the pad over the target motherboard area, power up the board with a DC power supply, and watch for the color-changing hotspots.
Primary Applications:
- Diagnosing dead or shorted smartphone motherboards (e.g., iPhones, Android devices).
- Pinpointing faulty surface-mount devices (SMD) and BGA components during rework.
- Rapid hardware quality control and field troubleshooting.
Reviews
There are no reviews yet.