Key Technical Specifications
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- Chip Support: Expands coverage to 102 chip models.
- Included Kit: Includes a specialized fixture and 17 precision 3D stencils.
- Material & Build: Built from high-toughness steel and aerospace-grade aluminum with high thermal resistance, weighing roughly 0.50 kg.
Core Features
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- Magnetic Dynamic Clamping: Features an automatic magnetic alignment structure for high-precision clamping during heat-gun rework.
- Integrated 2-in-1 Design: Combines glue removal and reballing on a single magnetic fixture.
- Uniform Solder Formation: Uses 3D stencils designed to prevent bulging and ensure consistent solder balls.
Supported Chipsets & Devices
- Apple: Supports CPU models from A8 through A19/Pro.
- Android & Others: Compatible with Qualcomm Snapdragon SM8450 to SM8750, MediaTek Dimensity, Exynos, HiSilicon, and memory packages like BGA 376, 436, 496, and 556.





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