🌟 Key Product Specifications
- Device Compatibility: It works seamlessly across Apple iOS and Android platforms, supporting major brands like Huawei, Samsung, Xiaomi, OPPO, and Vivo.
- Supported Chip Models: Out of the box, it supports between 84 to 85 specific chip variants, spanning mobile CPUs (Apple A8 through A18 Pro), EMMC, BGA, and RAM modules.
- Included Stencils: It ships with a set of 14 high-precision 3D BGA stencils optimized for precise solder paste alignment.
🛠️ Core Features & Capabilities
- Magnetic Clamping: It utilizes dynamic magnetic positioning to secure ICs automatically without damaging delicate silicon edges.
- High Temperature Resilience: The platform base is crafted from specialized steel and anti-slip composites to withstand high heat gun temperatures without deforming during desoldering.
- 3D Tin Planting: Custom-fit 3D steel stencils prevent the mesh from bulging or warping, ensuring uniform solder ball distribution.
- Future-Proof Expansion: The platform’s modular physical configuration supports unlimited future expansions via new stencil additions
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