Key Technical Specifications
- Tip Style: Curved-tip micro-precision design.
- Material: High-grade Titanium Alloy.
- Core Application: Logic board repair, BGA chip handling, flying wire setups, and micro-soldering.
Primary Features
- Reinforced Structure: Features an extended and reinforced mouth profile to prevent the tips from bending or warping under normal pressure.
- Chemical Resilience: Highly resistant to corrosive repair substances such as PCB cleaners, rosin, flux, and industrial solvents.
- Thermal Endurance: Built to tolerate high-temperature environments, making it ideal for close-quarters hot air rework station tasks.
- Strong Clamping: Fine polishing on the inner surfaces ensures a strong grip on small scattered parts or microscopic jump wires.





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