Key Product Details
- Diameter Precision: At 0.7mm (0.27 inches), it is thin enough to avoid bridging on modern smartphone motherboards, IC chips, and micro-PCB tracks.
- Material Integrity: High-purity composition ensures shiny, strong conductive joints and minimal oxidation or splatter during melting.
- Built-in Flux Core: Eliminates the need to apply extra external flux manually, ensuring clean wetting and rapid bonding
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