Key Technical Specifications
The system utilizes independent microcomputer digital LED displays to offer precise temperature control across all three functions:
| Feature / Component | Specification |
|---|---|
| Input Voltage | AC 220V / 110V (50/60Hz) |
| Hot Air Gun Power | 480 Watts |
| Soldering Iron Power | 90 Watts |
| Screen Separator Power | 600 Watts |
| Hot Air Temperature | 100°C – 480°C |
| Soldering Iron Temperature | 200°C – 480°C |
| Separator Plate Temperature | 50°C – 150°C |
| Airflow Type & Max Capacity | Brushless fan, gentle wind, max 120 L/min |
Core Features
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- All-in-One Space Saver: Combines a high-temperature hot plate (for weakening smartphone display adhesives and cleaning OCA glue), an SMD hot air blower (for BGA, IC, and PLCC chip desoldering), and a high-power soldering iron.
- Safety Protections: Equipped with ESD (Electrostatic Discharge) safety standards to safeguard sensitive microelectronics, intelligent cooling features, and automatic handle-docking standby modes for the hot air gun.
- Independent Controls: The console features separate physical power switches and dedicated temperature adjustments for every sub-station component.
Critical Safety & Operating Rules
- Proper Grounding: The machine must be connected to a properly grounded electrical line to minimize the risk of ESD damage or electrical shocks.
- No Live Hot-Plugging: Strictly avoid plugging or unplugging the soldering iron or hot air gun handles while the main power supply is turned on, as this can instantly burn out the internal control board circuits.
- Burn Hazard: The top glass-separator surface functions as an open, high-temperature heating element. Do not touch the plate directly while operational.
- Flammable Environments: Do not operate the rework station in close proximity to volatile chemicals, explosives, or highly flammable materials.
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