Key Product Details
- Core Application: Securely holds smartphone logic boards (PCBs), logic boards, CPUs, and small integrated circuit (IC) chips in place during heat gun soldering or de-gumming procedures. [1, 2]
- Dimensions: Built with a compact form factor measuring 75mm in length and 60mm in width, featuring a slim 13mm profile thickness for stable benchtop operation.
- Materials & Design: Utilizes an extended wheelbase layout paired with high-temperature resistant aircraft glass. This insulated glass surface stops heat from drawing away from the component, optimizing hot air rework.
- Clamping System: Features an adjustable central rotary spindle knob and physical V-groove jaw configurations to securely align rectangular and square-shaped silicon microchips.
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