Key Specifications & Product Data
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- Formulation Type: UV-559 (High viscosity, resinic pasty flux mixed with high-quality alloyed powder).
- Volume & Packaging: 10cc (10ml) syringe-style tube for precise dispensing control.
- Chemical Characteristics: Weakly acidic pH, halogen-free, lead-free, and RoHS compliant.
- Appearance: Milky/off-white pasty consistency that leaves a clear, non-corrosive residue preventing pale-yellow stains.
- Insulation Properties: Highly insulated, meaning any leftover flux won’t cause short-circuits on high-density logic boards.
Primary Applications
The high activity and wetting capabilities make this flux paste highly effective for:
- Mobile Phone & Laptop Repair: Ideal for delicate smartphone logic boards and computer hardware maintenance.
- BGA, PGA, & SMD Rework: Perfect for IC chip reballing, surface-mount technology (SMT) component soldering, and desoldering micro-electronics.
- Oxidation Prevention: Prevents surface oxidation on gold, copper, phosphorus, and bronze during high-temperature operations.




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