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KOOCU 183°C Solder Paste Flux (35g).

Original price was: ₨ 600.Current price is: ₨ 550.

KOOCU 183°C Solder Paste Flux (35g) is a specialized eutectic tin-lead alloy compound meticulously developed for advanced micro-soldering, integrated circuit reballing, and precise electronics assembly.

Availability: 5 in stock

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Core Product Specifications
  • Brand: KOOCU®
  • Net Weight: 35 grams per container
  • Alloy Composition: Sn63 / Pb37 (63% Tin, 37% Lead)
  • Melting Point: 183°C (361°F)
  • Particle Size: 20–38 microns (Type 3 / Type 4 paste standard) 

Key Technical Attributes
Eutectic Performance
The 63% Tin and 37% Lead compound creates a precise eutectic alloy. It changes instantly from a solid to a liquid state at exactly 183°C without entering a semi-solid, pasty middle state. This property minimizes component shifting during heat application and prevents cold solder joints.
Micro-Solder Integrity
The finely atomized spherical alloy spheres (20–38µm) flow smoothly through stencil apertures. This structure provides consistent deposition thickness, reducing bridging defects on tight-pitch pin arrays.
Built-In No-Clean Flux
The paste includes an integrated rosin-based, no-clean flux vehicle. It strips surface oxides when heated, creates strong wetting, and leaves non-conductive, clear residue that does not require washing after reflow.

Primary Applications
The product is explicitly intended for professional electronics repair workflows:
  • BGA Reballing: Creating uniform solder bumps on mobile phone ICs, CPUs, and GPU chipsets.
  • SMD / SMT Rework: Soldering surface-mount devices onto high-density printed circuit boards.
  • Mobile Device Repair: Repairing circuit boards on smartphones (e.g., iPhones, Android models), laptops, and game consoles.

Storage and Handling Guidelines
  • Temperature Regulation: For long-term storage, seal the container tightly and keep it refrigerated between 2°C and 10°C. This slows down flux oxidation and prevents the mixture from separating.
  • Prep for Use: Always allow the paste to reach room temperature naturally (approx. 2 to 4 hours) before unsealing. Opening it while cold introduces ambient moisture condensation, which can cause solder spattering during reflow.
  • Safety Warning: This compound contains Lead (Pb). Always work in a well-ventilated space equipped with a fume extractor to avoid breathing in chemical vapors. Wash hands thoroughly after handling.

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