Key Product Features
- Ergonomic Handle: Features a sandblasted, frosted alloy texture for a slip-resistant grip.
- Oxide Layer Protection: The handle surface is current-treated to form a colored oxide layer, boosting durability.
- Ultra-Thin & Sharp: Manually processed smooth, sharp edges allow for repeated grinding and ultra-precise slicing.
- Multi-Purpose Blades: Designed to manipulate delicate motherboard ICs without causing thermal or physical damage.
The 4-In-1 Blade Lineup
The toolkit comes with four distinct blade shapes, each engineered for a specific repair task: [1, 2]
| Blade Model | Specific Purpose / Application |
|---|---|
| Model S | Safely separates the CPU from the NAND flash storage. |
| Model E | Cleans off stubborn IC CPU glue from phone motherboards. |
| Model X | Operates as a professional edge glue removal tool. |
| Model Y | Cuts through underfill black glue without scratching the motherboard circuit traces. |
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