Key Features
- High Precision Clamping: Specifically built to securely grip thin, multi-layered smartphone motherboards (such as iPhones and Android devices) without flexing or damaging delicate traces.
- Multi-Function Alignment: Features adjustable sliding blocks and grooved slots to accommodate various shapes and sizes of mobile phone PCBs.
- Heat Resistant Construction: Manufactured with premium, synthetic materials and metal components capable of withstanding direct exposure to hot air rework stations and high-temperature soldering irons without warping or transferring critical heat.
- Anti-Slip Base: Weighted design ensures the fixture stays firmly positioned on your ESD work mat, preventing accidental movement while handling microscopic components.
Common Applications
- Micro-Soldering: Stabilizing logic boards for intricate jumper wire modifications or BGA reballing.
- IC Chip Replacement: Securing the board tightly while safely removing or installing CPUs, power ICs, and NAND flash chips with heat guns.
- Glue & Resin Scraping: Providing a rigid platform when cleaning off black underfill glue or applying UV solder mask paste.
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