Key Technical Specifications
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- Clamping Mechanism: Features a tri-axial helical design driven by 3 high-precision, multi-head screw rods that allow multiple clamping combinations simultaneously.
- Motherboard Capacity: Outfitted with an auxiliary slider that expands the motherboard clamping stroke from 15mm to 86mm, adapting to 99% of Apple, Android, and irregular-shaped logic boards.
- Chip Capacity: Explicitly supports micro-clamping for standalone BGA and IC chips ranging from 4mm to 67mm.
- Material Composition: The base utilizes a high-temperature resistant, corrosion-resistant carbon fiber plate that stays perfectly flat under direct hot-air rework.
Core Structural Features
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- Dual-Layer Board Protection: Built with precision-engineered step grooves engineered specifically to prevent clamping damage to delicate dual-layer sandwich motherboards and edge-adjacent chips.
- Hollowed Heat Dissipation: The undercarriage features a unique open-hollow design that stops thermal accumulation from the hot air gun and makes clearing flux residues effortless.
- Vibration Resistance: Heavy, low-profile physical anchoring prevents slipping or positional displacement under a microscope lens.
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