Key Technical Specifications
- Melting Point: 138°C (Low temperature, ideal for heat-sensitive components).
- Net Weight: 30g packaged in a signature black round container.
- Formulation: Eco-friendly, lead-free, and halogen-free formula.
- Texture: Ultra-fine and homogeneous consistency designed to prevent air bubble formation.
Primary Benefits & Performance Features
- Protects Sensitive Components: The low 138°C melting threshold minimizes thermal stress, preventing damage to multi-layered PCBs, CPU chips, and nearby plastic components during micro-soldering.
- High-Precision Reballing: Its smooth fluidity and fine paste structure ensure uniform, bright, and full tin pearls that stick perfectly to stencils without causing virtual welding.
- Anti-Oxidation Properties: Features extreme resistance to oxidation, guaranteeing reliable, strong, and highly conductive joints that will not degrade or desolder easily over time.
- No-Clean Formula: Leaves minimal, non-conductive, and clear residue behind. This removes the strict need for intense scrubbing, helping protect delicate surface-mount traces.
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