Key Product Specifications
- Brand & Model: LUOWEI LW-SP3.
- Melting Point: 158°C (Medium-low temperature variant).
- Net Weight: 30g container.
- Composition: 100% Lead-Free, Halogen-Free, and Odorless eco-friendly formula.
Core Technical Benefits
- Thermal Safety: The 158°C melting point provides an ideal middle ground for technicians. It allows you to solder delicate components like CPU IC chips and sensors without exposing the PCB to the high thermal stress of standard 217°C lead-free formulas.
- Ultra-Fine Texture: Features a homogeneous micro-particle consistency that prevents the formation of air bubbles, ensuring highly secure solder ball adhesion during reballing.
- Anti-Oxidation & High Viscosity: Formulated with advanced wetting agents that resist surface oxidation. The high-viscosity paste offers superb control during stencil application, preventing bridging or messy tin flow.
- Reliable Joints: Eliminates “virtual welding” (cold joints), yielding bright, physically strong, and electrically non-conductive solder joints that don’t degrade over time.
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