Key Specifications & Formula
- Melting Point: 183°C (Medium temperature standard paste).
- Net Weight: 30g per container.
- Composition: New generation formula featuring up to 90% tin content with ultra-fine, homogeneous particles.
- Safety Profile: Eco-friendly, lead-free, halogen-free, and completely non-conductive to safeguard sensitive printed circuit boards.
Performance Characteristics
- High Activity & Oxidation Resistance: Exceptional storage stability and high resistance to oxidation, meaning the paste retains its wetness and consistency during long repair sessions.
- Bubble-Free Fluidity: Its fine texture provides good fluidity and strong adhesion. It heats into crisp, clean tin spheres without scattering or creating structural air bubbles.
- Low Rework Rate: It delivers strong, delicate, and bright solder joints, which limits desoldering risks and reduces the need for secondary repairs.
- Zero Residual Damage: Leaves minimal, harmless residue while lowering the risk of thermal stress or heat damage to surrounding components during application.
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