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MaAnt Universal Multi-Functional BGA Reballing Black Stencil

Original price was: ₨ 900.Current price is: ₨ 750.

MaAnt Universal Multi-Functional BGA Reballing Black Stencil (also referred to as a “Black Net”). This professional hardware tool is engineered specifically for electronics technicians performing BGA (Ball Grid Array) chip repair and chip reballing on smartphones, tablets, and consumer electronics

Availability: 2 in stock

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Key Specifications & Features
  • Anti-Glare Black Coating: The specialized matte black finish minimizes reflection and eye strain when technicians work under high-magnification microscope lenses.
  • Square Chamfer Holes: It features laser-cut, chamfered square openings (T=0.12 mm thickness). These angular walls help the solder paste release easily and cleanly, leading to perfectly uniform, rounded solder balls. 
  • Grid Size Variety: The array provides multiple grid options for different pitch sizes, including 0.30mm, 0.35mm, 0.40mm, and 0.50mm pitches across diverse component sizes (e.g., 32×32, 35×35, 48×48, and 50×50 arrays)
  • High-Temperature Defiance: Constructed from premium, hard-wearing alloy steel that strongly resists bending or thermal deformation during intensive hot-air station heating.
Integrated Detachable Tools
Built directly into the bottom breakaway tabs are three custom mini-blades labeled Ant 1, Ant 2, and Ant 3. Technicians can break these away to clean excess solder paste, apply paste across the matrix, or pry up components smoothly.

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