Key Product Details
- Temperature Variant: It has a 138°C melting point, which categorized it as a low-temperature paste.
- Primary Application: This temperature profile is primarily used for screen IC soldering and delicate motherboard middle-layer reballing. It protects high-temperature-sensitive components during the repair process.
- Packaging & Quantity: The item is marked under model MG138 and comes in a compact 55-gram plastic tub.
- Target Audience: Built for mobile repair technicians dealing with BGA, SMD, IC, and CPU repairs.
Contact and Ordering Information
The promotional flyer provides direct local merchant contacts for inquiries or purchases:
- Supplier Name: Spogmai Mobile Zone Parts & Tools
- Contact Numbers: 03429557277 or 03449643839
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