Key Product Specifications
- Alloy Composition: Formulated using a Sn63/Pb37 ratio, containing 63% Tin and 37% Lead.
- Melting Point: Reaches a strict eutectic liquidus threshold at 183°C (361.4°F).
- Net Weight: Distributed in a standard compact 35-gram container or syringe configuration.
- Particle Profile: Typically falls into Type 3 or Type 4 micro-diameter particles (20–45 microns), protecting ultra-fine pitch components from structural bridging defects.
Operational Features & Benefits
- Optimized Viscosity: Engineered with an integrated anti-drying, moderate moisture flux vehicle (IPX3 grade) that reduces component misalignment and eliminates cold or virtual joints.
- High Wetting Properties: Provides rapid thermal transfer and strong climbing tin properties during reflow, leaving minimal, non-corrosive, no-clean clear residue.
- Targeted Application: Specially formulated for mobile phone motherboard repair, BGA chip reballing, logic board SMD component installation, and sensitive charging port connector replacement
Critical Usage & Handling Guidelines
- Temperature Restoration: Always allow the paste to sit sealed at standard ambient room temperature for at least 2 to 4 hours prior to opening if it has been stored under refrigeration. This prevents ambient moisture condensation.
- Homogenization: Stir the compound thoroughly for roughly 1 minute using a dedicated anti-static spatula before transferring it onto a stencil or circuit board.
- Storage Profile: Keep the container tightly sealed and stored in a cool environment (ideally between 2°C and 10°C) to prevent the compound from drying out or suffering from prematurely accelerated flux separation.
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