Key Specifications & Features
- Application: Specially formulated for electronics, PCB, BGA, PGA, and SMD rework.
- Weight: 100-gram container.
- Composition: Lead-free material optimized for high activity and strong welding joints.
- Residue Properties: Low-residue and no-clean formula, minimizing electrical interference.
- Performance: Provides high surface insulation resistance and limits false welding.





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