Key Technical Specifications
-
- Brand: MASTERGO
- Model Number: MG158
- Melting Point: 158°C (Medium-Temperature Formula)
- Net Weight: 55g per jar
- Origin: Made in China
- Application Scope: Engineered for iPhone and Android phone mid-layer (sandwich motherboard) repair operations, BGA chip reballing, SMD component soldering, and IC/CPU repairs.
Promoted Product Features
-
- Anti-Oxidation Formula: Offers a long shelf life and high oxidation resistance to ensure consistent reliability during reflow.
- Clean Soldering Joints: Features strong welding ability that leaves minimal residue, maintaining clean circuit boards after welding.
- Bright & Uniform Solder Beads: Formulated to reduce the problem of “false” or virtual soldering, yielding smooth and highly conductive joints.
- Optimized Viscosity: Prevents component shifting and slumping when scraping the paste over stencils.
Operational Usage Notes
In professional microsoldering, the 158°C melting point serves as an ideal intermediate tier. It provides greater mechanical strength and fatigue resistance than 138°C low-temperature paste, while shielding fragile surrounding components from the intense heat stress required by standard 183°C leaded or 217°C lead-free high-temperature solder pastes.
Reviews
There are no reviews yet.