Key Specifications & Functionality
- Steel Wire Head:
- Made of ultra-fine, imported steel wire featuring high hardness with minimal deformation over time.
- Used to quickly strip away stubborn residual OCA glue, hard bonding tin, and oxidation from IC contact pads.
- Provides a gentle polishing effect to safely restore circuit pads back to a clear, like-new surface finish.
- Bristle Brush Head:
- Features highly elastic, anti-static bristles designed to avoid shedding and distortion during scrubbing.
- Safeguards sensitive integrated circuits (ICs) and motherboard layers against dangerous ESD (Electrostatic Discharge).
- Best utilized for dusting away light particulate matter, loose debris, and corrosive chemical flux residues post-soldering.





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