Key Product Highlight.
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- 3-Second Ultra-Fast Cure: Unlike traditional green solder masks (like UVH900) which can take up to several minutes to fully harden, the newer SU3 and SU7 formulas cure almost instantly (in 3 to 10 seconds) under a high-intensity 365–395 nm UV light tool.
- High Thermal Resistance: It maintains structural stability up to 280°C, meaning it will not soften or degrade during hot-air rework or BGA chip desoldering.
- Complete Insulation & Protection: Forms a tough, scratch-resistant barrier that protects exposed copper traces from short-circuits, oxidation, arcing, and moisture.
Primary Repair Applications
- Jumper Wire Shielding: Securely holds and insulates thin enameled copper jumper wires after fixing broken board traces so they do not touch nearby components.
- Welding Pad Restoration: Rebuilds missing or damaged green solder resist layers beneath pulled BGA pads or around detached chips.
- Structural Component Reinforcement: Stabilizes fragile physical anchor points, such as structural screw posts, micro-USB / Type-C tail plugs, and battery connectors.
Step-by-Step Usage Guide
- Clean the Area: Prep the target circuit surface using a brush and industrial isopropyl alcohol to thoroughly remove any residual flux, grease, or dirt.
- Apply the Mask: Dispense a very small, thin bead of the green ink directly onto the trace using a syringe needle or fine probe. Avoid thick globs, as excessive thickness can trap uncured liquid beneath the top crust.
- Expose to UV Light: Shine a targeted 365nm-395nm UV curing lamp directly over the paste from a close distance for 3 to 10 seconds until completely solid.
- Wipe Excess: If any wet ink remains on areas where solder needs to stick, wipe it away cleanly using a solvent-moistened swab before it receives UV light exposure
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