Key Features & Technology
- High-Density Warp-Weft Structure: Woven tightly to resist fraying, loose wires, deformation, and burring during intensive use.
- Proprietary Distillation Flux: The integrated activation agents are deeply embedded into the weave gaps, accelerating suction speeds and leaving zero residue behind.
- Anti-Fray Treated Edges: Specially finished border paths prevent unravelling and powder shedding.
- Dual-Layer Capability Layering: It splits its size chart into single-layer and double-layer models to match specific target heat capacities:
- Single-Layer (2.0mm / 3.0mm widths): Heats up exceptionally fast; optimized for rapid, light-absorption work at a recommended temperature of 300–330°C.
- Double-Layer (1.5mm / 2.5mm / 3.5mm widths): Delivers 100% greater volume capacity to pull massive solder pools out of multi-pin components at a recommended temperature of 330–350°C.
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