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Mechanic DUSTY LA-03 Anti-Blowout Reballing Pad.
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Mechanic DUSTY LA-03 Anti-Blowout Reballing Pad.

Original price was: ₨ 500.Current price is: ₨ 350.

The Mechanic DUSTY LA-03 Anti-Blowout Reballing Pad is a highly specialized micro-soldering auxiliary tool designed to prevent solder paste explosion and stencil warping during BGA chip repairs. Crafted from a premium 20x20mm white tempered glass material, it sits under or around the integrated circuit (IC) or stencil to ensure flat, uniform heat absorption. This completely eliminates the sudden popping or splattering of molten solder balls caused by trapped moisture or localized thermal expansion.

Availability: 4 in stock

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Key Technical Specifications
  • Dimensions: 20mm x 20mm
  • Material: High-grade, high-temperature white tempered protection glass
  • Primary Function: Anti-blowout, explosion-proof tin gasket, and heat insulation
  • Compatibility: Ideal for mobile phone CPU, GPU, and logic board middle-layer chip repairs 

Core Benefits & Mechanisms
  • Zero Solder Blowouts: Secures the solder paste, preventing tin balls from bursting or splashing outwards under intense heat gun pressure.
  • Thermal Shock Resistance: Engineered to handle the high temperatures required for leaded and lead-free micro-soldering without warping.
  • Enhanced Visual Clarity: The stark white glass backdrop dramatically improves contrast under standard repair microscopes, making alignment faster and reducing eye strain.
  • Flat Stencil Support: Prevents fragile steel reballing stencils from bulging upward halfway through the reflow process.

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