Key Specifications & Materials
- Alloy Composition: 60% Tin (Sn) / 40% Lead (Pb)
- Wire Diameter: 0.6 mm (ideal for small components and medium-density surface mount technology)
- Flux Core: Integrated Rosin Core flux (1.0% to 3.0% content), removing the need for separate external flux in basic tasks
- Melting Point: Approximately 200°C to 300°C
- Weight: 40 grams gross weight per single spool
Core Performance Features
- High Wettability & Fluidity: The M60 alloy spreads quickly and uniformly, ensuring excellent through-hole penetration and the complete elimination of microscopic voids.
- No-Clean Rosin: The flux formula requires minimal or no post-soldering cleanup, leaving behind benign, non-corrosive residues.
- Thermal Shock Reduction: Its reliable melting dynamics allow for fast joints, which minimizes the heat exposure time for sensitive ICs and surface-mount components.
- Clean Operational Use: Engineered to emit low smoke, low splashing, and a non-pungent odor compared to lower-grade alternatives.
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