Key Features and Specifications
- Massive Variety: A single sheet contains up to 2,780 preformed solder joints in various shapes and sizes (round, square, elongated) to match different PCB traces.
- Ultra-Thin Design: Made from industrial-grade copper foil measuring only 30μm thick, ensuring the replaced pad sits completely flat to prevent uneven chip alignment or pseudo-soldering.
- Fixed-Pin Technology (2nd Gen): Upgraded versions feature extended “wings” or anchoring fixed pins that lock the pad securely to the motherboard, preventing it from detaching during subsequent soldering.
- High Conductivity: Delivers excellent thermal and electrical conductivity with strong anti-oxidation gold plating or high-purity alloy coating.




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