Core Product Capabilities
- Efficient CPU Degumming: Holds the delicate CPU firmly in place while you use specialized glue-removal blades or chemical solvents like Mechanic CPU Degumming Liquid and a brush. It allows you to strip off tough factory black underfill adhesive quickly without lifting or dropping delicate solder pads.
- Magnetic Levitation Clamping: Built-in high-strength magnets create an automatic, self-clamping slider mechanism. This ensures the CPU is securely aligned and immobilized under a strong magnetic field during high-precision scraping or soldering.
- Precision Solder Reballing: Features uniquely aligned, high-temperature resistant steel stencils. The stencils snap magnetically into place, ensuring solder paste sits uniformly to produce bright, full, and perfectly rounded solder joints free of false soldering.
- High Thermal Endurance: Manufactured from an advanced synthetic stone nano-composite material. The base withstands temperatures reaching up to 500°C, providing structural stability, anti-static safety, and anti-corrosion protection during hot-air rework.
Operational Recommendations
- Chemical Aid: For safest execution, combine the physical fixture with an underfill remover solvent to soften the factory epoxy.
- Heat Management: Utilize a reliable hot air station paired with hand-polished, ultra-thin degumming blades to slide cleanly underneath the glue without scratching the chip’s core circuitry.
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