Core Technical Specifications & Pricing
- Clamping Travel Distance: Up to 50mm large area travel, making it highly versatile for various phone and small device logic boards.
- Motherboard Capacity: Features a dedicated 32mm motherboard clamping area designed to universally lock down standard smartphones.
- Heat Resistance: Built using aluminum alloy and specialized composite materials capable of enduring high temperatures (up to 105°C–500°C depending on specific regional product variations), protecting the base during intense heat gun usage.
Key Product Highlights
- 360-Degree Rotation: Employs a damping turntable that smoothly rotates all the way around, allowing technicians to switch workspace angles without unlocking the board.
- Coaxial Dual-Axis Movement: Designed with a self-centering, automatic middle-fixing system that ensures uniform pressure from both sides, perfectly anchoring irregularly shaped PCBs.
- Unobstructed Working Profile: The clamp profiles are engineered to sit completely flush with or below the chip surface, meaning there is no obstruction for tin scraping knives, glue removal blades, or dental picks.
- Microscope Compatibility: Features a low-profile, weighted non-slip base that fits cleanly directly underneath a microscope lens layout or sits firmly on a silicon workbench mat.
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