Key Features and Capabilities
- Motherboard Stabilization: Securely locks double-layer smartphone logic boards in place during hot-air rework.
- Dedicated IC Positioning: Built-in dedicated slots to clean and remove glue from Apple A7 through A12 CPU chips.
- Component Slots: Specialized zones to safely secure NAND PCIE flash memory chips and logic board components.
- Fingerprint Module Repair: Includes dedicated molds to hold front home button/fingerprint assemblies for stabilization during intricate trace repairs.
- Thermal Management: Synthetic composite build integrated with custom heat-sink layers prevents board warping from high-temperature soldering.
Platform Compatibility
This tool natively supports motherboard components for a broad range of classic iOS devices, including:
- iPhone XR, 8 Plus, 8, 7 Plus, 7, 6S, 6S Plus, 6 Plus, 6, 5S, and 5.
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