Key Product Features
- Form Factor: Packaged as a 10cc syringe designed to accept standard needle dispenser tips and plunger injectors for highly localized application.
- No-Clean Formula: Leaves a pale, minimal yellow residue that features incredibly high Surface Insulation Resistance (SIR), meaning you generally do not need to clean it off post-soldering to prevent circuit degradation.
- Oxidation Prevention: Chemically formulated to remove existing surface oxides and prevent new oxidation on sensitive contact metals like copper, gold, and bronze during heating.
- Wetting & Solder Flow: Promotes fast, uniform heat transfer, allowing molten solder to bond instantly and create bright, highly durable solder joints.
Target Applications
- SMD / SMT Component Rework: Soldering surface-mount components, small logic chips, and discrete board elements.
- BGA Reballing & Repair: Highly recommended for computer, tablet, and smartphone chip replacements, as well as CSP ball array repair.
- Port Replacement: Perfect for applying via injector onto logic boards when replacing charging ports, HDMI slots, or multi-pin connectors.
Usage Tips & Availability
- Injectors & Needles: While the paste comes inside a 10cc syringe tube, many standard retail packs only include a basic plastic cap. Metal push plungers and specialized needle tips are often sold separately or bundled in advanced tool kits depending on the vendor.
- Safety: Always work in a well-ventilated area, as the rosin components will smoke and omit a noticeable smell when activated by a soldering iron or hot air rework station.
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