Key Specifications
- Brand: MEGA-IDEA (by QianLi)
- Pitch Sizes: Supports universal pitches including 0.3mm, 0.35mm, 0.4mm, and 0.5mm
- Thickness: 0.12mm optimal thickness for controlled tin distribution
- Material: Premium high-temperature black planting tin steel mesh
- Design Features: Square matrices aligned dynamically to reduce heat deformation during hot air reworking.
Function and Application
This stencil is specifically designed for BGA (Ball Grid Array) IC reballing on smartphone logic boards. Technicians use it to place solder paste accurately across varying multi-functional chip footprints before applying heat. The distinct black anti-glare finish protects the eyes from strong microscope light reflections, easing long hours of precision repair work.
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