Technical Specifications
- Melting Point: 138°C (Low-temperature profile).
- Packaging: Syringe needle tube (prevents waste and allows precise direct application).
- Composition: Lead-free and halogen-free formula.
- Viscosity: High-viscosity, no-clean formulation leaving minimal residue.
Primary Applications
- Double-Layer Motherboards: Perfect for separating and joining sandwiched iPhone or Android logic boards without damaging underlying components.
- Heat-Sensitive ICs: Safely solders delicate BGA microchips, CPUs, and SMD components without exposing them to extreme reflow temperatures.
- Component Safety: Minimizes the risk of thermal shock, board warping, and neighboring component displacement.
Key Benefits
- High Precision: The needle plunger setup ensures that you can squeeze out exact quantities directly into tight spaces or micro-stencils.
- Strong Adhesion: Formulated with high wettability to provide shiny, strong, and highly conductive solder joints despite the lower melting point.
- Anti-Oxidation: High-purity tin content ensures that uniform solder beads form easily without foaming or premature oxidation.
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