Key Technical Specifications
- Temperature Regulation Range: 50°C to 300°C.
- Heating Performance: Reaches 183°C in roughly three minutes.
- Input Voltage: Dual-gear shifting (110V / 220V) with a single button switch.
- Safety Features: 15-minute automatic intelligent sleep countdown.
- Expansion Options: Supports standard slots, universal modules, dot-matrix platforms, and specific IC reballing bases.
Core Procedural Steps for Preheating & Board Separation
- Prepare the Motherboard: Gently peel or cut away the EMI shielding stickers along the edges of the sandwich board so they do not trap or restrict the upper layer during separation.
- Mount a Lifting Point: Thread a small screw into a designated screw post on the logic board. This acts as a safe lifting handle later to avoid burning your fingers or straining delicate traces.
- Secure the Board: Position the target motherboard on the corresponding Mijing MS1 Modular Expansion Plate and clamp it firmly using the blue spring-loaded retention arms.
- Set Temperature and Timer: Switch on the base power cable. Use the physical control buttons near the digital display to dial in your targeted temperature (typically preset to 200°C with a 300–second countdown).
- Preheat and Separate: Press the confirmation button to trigger the heating cycle. Monitor the solder properties; layers generally soften enough for safe lifting within 3 minutes of heat exposure, preventing thermal damage to surface-mount components.
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