Key Specifications & Layout
- Double-Sided 4-in-1 Design: Features precise, built-in compartments on both sides with four different depths tailored for varying chip dimensions: 0.3mm, 0.4mm, 0.7mm, and 0.8mm.
- High-Grade Silicone Material: Offers premium durability, high wear resistance, and anti-corrosive properties.
- Thermal Resistance: Safely handles high-temperature operations, protecting your workbench from direct heat-gun and soldering-iron exposure during intensive desoldering.
Primary Applications
- BGA & CPU Reballing: Keeps BGA reballing stencils magnetically flattened, completely eliminating warping or shifting while pasting and heating solder tin.
- IC Chip Cleanup & Degumming: Holds NAND, CPU, and EMMC chips securely, providing steady leverage for glue or underfill removal.
- Flex Cable Repairs: Ideal for locking down small, intricate pieces such as iPhone fingerprint flexes, Face ID dot matrix components, or front camera arrays during micro-soldering.
- Parts Organization: Features a magnetic surface area that prevents microscopic screws and tiny metal components from bouncing away or getting lost.
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