Key Features & Specifications
- 360° Rotary Positioning: Features a smooth, universal rotating mechanism that provides full-angle adjustment. This allows technicians flexible access to delicate IC chips and PCB areas for highly accurate soldering and rework.
- One-Handed Degumming Operation: Specifically optimized for handling black adhesive/glue removal on chip packages. The quick-locking, rotating open-and-close design allows for effortless, single-handed clamping adjustments.
- Multi-Form Clamping Support: Engineered with dual-screw fastening and high-precision slots to securely grip various chip specifications and shapes, supporting components up to 32mm (including common sizes like 20mm).
- Stable, Heavy-Duty Build: Constructed with a durable metal frame and paired with a heat-resistant rubber pad and an anti-slip rubber base. This setup minimizes vibration and protects components under intense heat-gun pressure.
- Ultra-Compact Footprint: Measuring just 80mm x 20mm and weighing roughly 200g, it fits seamlessly into tight microscope work setups and toolkits without cluttering the repair bench.




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