Key Technical Specifications
- Function: Primary Power Management IC (PMIC).
- Package Type: Ball Grid Array (BGA) package requiring precise micro-soldering.
- Operating Voltage: 1.0V to 6V.
- Power Dissipation: 0.6W.
- Protection Features: Built-in over-voltage and over-current protection circuitries.
Known Device Compatibility
This chip is integrated into specific MediaTek-powered smartphones, including:
- Xiaomi: Found inside the Xiaomi Redmi Note 8 Pro motherboard assembly.
- Vivo: Utilized in the Vivo X70 Pro hardware architecture.




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