Key Technical Specifications
- Material Base: Uses imported nano-level silver powder with a particle size under 100nm.
- Composition: Features an exceptionally high solid content of 85%.
- Resistance Profile: Extremely low electrical resistance combined with high current transmission capabilities.
- Thermal Endurance: Maintains stable conductivity and structural adhesion even in high-temperature environments.
Primary Applications
- Screen Flex Circuit Restoration: Specifically formulated to repair water-damaged or defective iPhone and Android screens suffering from yellow, green, or white screen errors.
- PCB Trace & Break Repair: Restores broken connections on core smartphone motherboards, ribbon cables, and Indium Tin Oxide (ITO) layers.
- Jump Wire Alternative: Allows technicians to draw a clean conductive line rather than manually micro-soldering physical copper jumping wires.
How to Use the Paste Effectively
- Surface Prep: Clean the target area thoroughly using isopropyl alcohol to eliminate dirt, leftover flux, or oxidized layers.
- Precision Dispensing: Use a fine-tipped needle or micro-brush to lay down a thin, continuous trace exactly where the electrical path is broken.
- Thermal Curing: Apply heat (using a hot air rework station or curing light setup) to solidify the paste and activate its maximum bonding strength.
- Short-Circuit Prevention: Once fully cured, coat the exposed repair zone with an insulating UV green solder mask oil to prevent accidental cross-connections.
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