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RELIFE RL-093C 0.5mm thick pure copper chip heat sink sheet.

Original price was: ₨ 1,000.Current price is: ₨ 850.

The RELIFE RL-093C is a 0.5mm thick pure copper chip heat sink sheet designed for rapid cooling and thermal management in mobile phone motherboard repairs. It provides high thermal conductivity to transfer heat away from the processor during intensive tasks or after reballing.

Availability: 2 in stock

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Key Specifications
  • Thickness: 0.5mm (Specifically designated by the “C” variant)
  • Dimensions: 12.45mm × 14mm
  • Material: Pure Copper
  • Quantity: Typically sold in a pack of 50 pieces 
Product Features
  • High Thermal Conductivity: Rapidly transfers heat from phone processors (CPU), graphics chips (GPU), or power ICs to prevent overheating.
  • Corrosion Resistance: Crafted from high-grade copper ensuring physical durability inside delicate electronics.
  • Precision Fit: Specifically sized for phone motherboards including Apple, Huawei, Xiaomi, and Samsung devices.
  • Multi-Layer Isolation: Helps shield the underlying CPU chip from short circuits with surrounding shielding components.

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