Key Specifications & Dimensions
- Dimensions: 12mm x 12mm
- Thickness: 2mm
- Quantity: 100 pieces per pack
- Color: Pastel Blue
- Base Material: High-elasticity Silicon RubberÂ
Product Features
- High Thermal Conductivity: Rapidly transfers thermal energy away from smartphone CPUs, power ICs, and memory chips to prevents system throttling and damage.
- Electrical Insulation (Non-Conductive): Ensures that nearby surface-mounted components will not short-circuit even when compressed tightly across exposed traces.
- Soft & Highly Compressible: The malleable nature allows it to comfortably fill uneven gaps and air pockets between motherboard components and the device’s chassis or shielding.
- Self-Adhesive & Peelable: Equipped with a clean, bubble-free adhesive layer that grips the surface securely without overflowing, eliminating the need for complex mechanical clips or messy thermal glue.
- Shockproof Cushioning: The elastic structure acts as a tiny shock absorber, shielding fragile micro-soldered components against dropped drops and vibration.
Core Applications
- Smartphone Repair: Specifically sized for motherboard repair targets like baseband processors, PMICs, and internal Wi-Fi modules.
- Consumer Electronics: Universally suited for small-scale heat management in laptops, tablets, LED lighting drivers, power supplies, and automotive electronic modules.
Basic Application Protocol
- Clean Surfaces: Clean any residual thermal paste, grease, or dust off the IC and the heatsink panel.
- Expose Adhesive: Peel back the protective carrier film from one side of the square pad.
- Press & Position: Align the pad over the chip, apply firm downward pressure to lock it into place, then remove the remaining top film.
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