Key Specifications & Features
- Form Factor: 10cc syringe barrel packaged with a manual push rod and dispenser needle for high-precision application.
- Viscosity & Activity: High-viscosity formula prevents the paste from spreading or flowing away to unwanted areas when hit with a hot air rework station.
- Composition: Made from premium imported rosin and a lead-free, halogen-free advanced formula that minimizes virtual or cold welding joints.
- No-Clean Formula: Leaves behind a pure, clear, and highly insulated residue. It does not turn into a messy pale-yellow crust and prevents short circuits without mandatory post-repair scrubbing.
- Work Environment: Formulated to run tin fast while producing minimal smoke and odors, making it more comfortable for bench technicians.
Common Applications
- BGA Reballing: Keeping micro solder balls anchored perfectly onto chip matrices during reflow.
- SMD & IC Rework: Safe for sensitive smartphone components like basebands, power ICs, and delicate CPUs.
- General PCB Repair: Revitalizing oxidized pads and component tinning on multi-layered laptop or gaming console circuit boards.
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