Key Specifications & Features
- Halogen-Free & Lead-Free: Fully compliant with RoHS safety standards to minimize toxic fumes and protect long-term PCB health.
- Premium Material Base: Formulated using high-purity rosin imported from Japan.
- Strong Activity & High Viscosity: Clears out oxidation quickly, enhances solder wetting, and ensures smooth tin flow without causing component bridging.
- No-Clean Formula: Designed to leave very low, non-corrosive residue. It does not compromise insulation resistance, eliminating the mandatory post-weld cleanup phase.
- Ergonomic Application: Packaged in a compact 10cc syringe barrel equipped with a push rod and precision needles for precise target dosing.
Primary Applications
- Smartphone Repairs: Highly rated for delicate mobile phone PCB and complex Apple/Android CPU reworks.
- BGA Reballing: Provides the necessary tackiness to hold micro-solder balls perfectly in place before reflow.
- SMD / SMT Soldering: Smoothly spreads heat and fluidly breaks surface tension across densely packed surface-mount boards.
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